Broadcom is emerging as a key supplier in the artificial intelligence (AI) supply chain, with revenue from AI-related chips now comprising a majority of its semiconductor business.
The recent increase in mature process DRAM prices is expected to boost Samsung Electronics' DRAM business revenue, offsetting the sluggishness in its high bandwidth memory (HBM) business and fueling momentum for its performance in the second quarter of 2025.
Amid escalating geopolitical tensions, global defense spending is surging, transforming the sector into a strategic growth pillar alongside semiconductors. For Taiwan's ChenFull Precision Co., these two industries form the backbone of its operations. While the company's defense segment remains modest in scale, its gross margin approaches 70%—a remarkable figure that outpaces all other business units and now serves as a critical driver of ChenFull's broader corporate growth.
In late April 2025, South Korea's ZDNet Korea reported that China is moving ahead with a major overhaul of its domestic semiconductor equipment sector, aiming to consolidate more than 200 companies into roughly 10 key players. While the announcement drew international attention, industry insiders in China have long seen this as an inevitable, if largely unspoken, challenge.
On June 10, 2025, Taiwan's Ministry of Economic Affairs (MOEA) invited Premier Jung-Tai Cho to attend the joint award ceremony for the National Industry Innovation Award and National Invention Creation Award. Cho stated that besides continuously promoting the "Five Trusted Industry Sectors," relevant ministries are drafting a new AI infrastructure plan aimed at driving the next wave of AI development in Taiwan. The goal is to industrialize AI, integrate AI into various industries and public sectors, and establish the most comprehensive supply chain.
AMD on June 12 officially confirmed that its next-generation AI accelerators—the Instinct MI350X and MI355X—will feature 12-high HBM3E memory supplied by Samsung and Micron. The confirmation marks a strategic win for Samsung, which has faced challenges qualifying its HBM3E for use in Nvidia's AI chips.
The SEMI has announced the appointment of Tien Wu, Chief Operating Officer (COO) of ASE Group, as the new Chairman of its International Board of Directors. Wu will succeed Mary Puma, the Executive Advisor of Axcelis Technologies, in this prestigious role, where he will lead SEMI's global operations, oversee its talent development programs, and work toward fostering the collaborative goals of the semiconductor industry community.
The number of senior technical executives at Samsung Electronics' foundry division has declined sharply over the past two years, raising concerns about the company's long-term competitiveness in the global semiconductor market.
On June 12, 2025, at VivaTech in Paris, Nvidia CEO Jensen Huang issued repeated warnings that tightening US restrictions on AI chip exports to China may backfire, accelerating the rise of Chinese tech giant Huawei and potentially undermining America's leadership in the global AI ecosystem. Huang emphasized that cutting off access to advanced chips may force China to double down on domestic alternatives—and succeed.
At AMD's Advancing AI 2025 event on June 13, AMD CEO Lisa Su and AI luminary Andrew Ng took the stage in a wide-ranging dialogue that emphasized the importance of democratizing AI through open ecosystems, developer empowerment, and broad access to computing resources. Their conversation underscored how AI is reshaping software engineering, education, and the job market—offering both immense opportunities and distinct challenges.
As data centers face increasing demands for AI training and inference workloads, high-bandwidth memory (HBM) has become a critical competitive edge for memory manufacturers. Micron announced that its 12-layer stacked 36GB HBM4 samples have been delivered to multiple major customers. Utilizing the 1β DRAM process technology, mass production is expected to begin in 2026 to support customer growth on next-generation AI platforms.
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