Memory manufacturers are reducing production capacity for older processes, driving DDR4 prices to skyrocket. Although Samsung Electronics' last buy order (LBO) for DDR4 was originally scheduled to end in June 2025, with production ceasing by the end of the year, memory module makers are already struggling to secure supply.

In a sign of China's accelerating ambitions in the semiconductor race, ChangXin Memory Technologies (CXMT), the country's leading DRAM manufacturer, is rapidly advancing development of next-generation memory technologies. Departing from its original plan to commercialize DDR5 using a 17-nanometer process, CXMT is now opting for a more advanced 16-nanometer node. A 15-nanometer process is also under development, with mass production targeted for late 2026.

SK Hynix is approaching the final delivery deadline for its May orders of thermal compression bonding (TCB) equipment from Hanmi Semiconductor and Hanwha Semitech, as the industry focus shifts to which vendor will secure contracts for the second half of 2025.

According to a press release on June 10, Micron Technology announced it has begun shipping samples of its 36GB HBM4 with 12-high stacking to multiple customers. The new memory is built on Micron's 1-beta DRAM process and features a 2048-bit interface capable of exceeding 2.0 TB/s per stack — more than a 60% performance improvement over its predecessor.

Samsung Electronics' foundry division is targeting the artificial intelligence (AI) chip market with a new collaboration alongside Groq, aiming to bring their jointly developed chip into mass production. Groq CEO Jonathan Ross recently stated that together with Samsung Foundry, they have created a truly outstanding chip on a global scale.

Chinese memory chipmaker Yangtze Memory Technologies Co. (YMTC) has filed a federal lawsuit in Washington, DC, accusing US-based Micron Technology of launching a disinformation campaign that falsely characterizes YMTC's chips as spyware-laden and a threat to national security.

China's largest cloud and internet companies are implementing backup supply chain strategies as bilateral trade uncertainties continue. Baidu Inc., Alibaba, Tencent and Huawei have developed contingency plans with domestic memory module manufacturers, beginning gradual localization in early 2025.

European financial securities firm UBS recently released a report indicating that Samsung Electronics' anticipated 12-layer HBM3E, originally expected by June 2025, may not be ready to supply Nvidia until the fourth quarter of 2025.

The Indian government has amended Special Economic Zone (SEZ) rules to support semiconductor and electronics component manufacturing, reducing the minimum land requirement from 50 hectares to 10 hectares for SEZs dedicated to these sectors. The changes, notified on June 3, 2025, also relax conditions on encumbrance-free land, allowing mortgaged or leased land held by government agencies to be used for SEZ purposes.

Kioxia, Japan's leading NAND flash memory manufacturer, is preparing for an aggressive expansion. The company has announced a bold plan to double its memory production capacity by fiscal year 2029, with a focus on increasing output to meet growing demand from sectors like artificial intelligence.

Samsung Electronics is accelerating its development of next-generation low-power memory technology, aiming to begin production of LPDDR6 using its advanced 1c DRAM process in the second half of 2025, according to a report by South Korean media outlet Businesspost. The company reportedly plans to supply major global tech firms such as Qualcomm, a strategic move to reinforce its leadership and counter rising competition from China's ChangXin Memory Technologies (CXMT).

Samsung Electronics's largest labor union lost almost 7,000 members in two months following the mass resignation of its executive leadership, potentially disrupting negotiations with management as the South Korean chipmaker grapples with production challenges and intensifying competition from TSMC.

Taiwan-based NAND controller manufacturer Phison Electronics posted a May 2025 consolidated revenue of NT$5.69 billion (approx. US$175 million), down 5.2% from the previous month but up 6% year-over-year. Cumulative revenue for January through May reached NT$25.531 billion, declining 5.7% annually but marking the third-highest on record.

These are the most-read DIGITIMES Asia stories from June 2 to June 8, 2025. Top highlights include Arm's strategic rebrand and entry into proprietary chip design, Huawei's aggressive R&D-driven resurgence, and growing momentum across Asia in AI semiconductors and advanced packaging. As global tech giants recalibrate in response to shifting supply chain dynamics, export controls, and rising open-source threats, the week's top stories reflect deepening fault lines—and fresh opportunities—across the semiconductor and system architecture landscape.

South Korean semiconductor equipment manufacturers are seeing a surge in demand from Chinese memory chipmakers, according to a report from Hankyung. ChangXin Memory Technologies (CXMT) and Yangtze Memory Technologies (YMTC) are placing urgent bulk orders - some reportedly at premiums of 1.7-2 times the original price - to secure tools essential for producing advanced LPDDR5 DRAM and high-bandwidth memory (HBM) products.

Memory module maker Goldkey Technology officially received approval from the Taiwan Stock Exchange on June 5, 2025, for its initial public offering (IPO), with a listing capital of NT$680 million (US$22.71 million). The company is well-positioned to capitalize on the recovery of the global memory industry in 2025 and anticipates significant growth momentum in the second half of the year.

Driven by the established trend of memory manufacturers reducing production, Team Group general manager Gerry Chen stated that memory prices are not expected to decline in 2025. The price gap between DDR4 DRAM and DDR5 will continue to narrow, while NAND flash prices are projected to maintain an overall upward trajectory. As a result, the company holds an optimistic outlook for operations from the second quarter to the third quarter.

Jim Elliott, a veteran executive who spent over 20 years leading Samsung Electronics' memory operations in the US, has reportedly exited the company to join rival NAND flash provider SanDisk as Chief Revenue Officer (CRO), according to sources cited by South Korea's Financial News (Fnnews) and Asian Economic News Agency.

Hanmi Taiwan, the local subsidiary of South Korea's Hanmi Semiconductor, reported explosive growth in the first quarter of 2025, generating 76% of its entire 2024 revenue in just three months. Industry analysts point to robust demand from key clients such as Micron Technology for maintenance services and component sales as the main driver behind the surge.

China's CXMT is accelerating its development of high-bandwidth memory (HBM) and DDR5 chips, mounting a direct challenge to the global DRAM dominance of Samsung Electronics and SK Hynix. The company plans to deliver HBM3 samples by late 2025 and begin mass production in 2026, with HBM3E (fifth-generation) development set for 2027. As reported by The Financial News (Fnnews), CXMT has advanced its HBM2 production timeline from 2026 to mid-2025, signaling a faster-than-expected ramp-up.

Micron Technology has begun mass production of its 1γ-based LPDDR5X memory, outpacing rivals Samsung Electronics and SK Hynix in the race to supply faster, low-power DRAM for AI smartphones. The chip achieves 10.7 Gbps speeds and is Micron's first mobile product built with EUV lithography.

Samsung Electronics is accelerating its push to reclaim semiconductor leadership, spotlighting its latest breakthrough in sixth-generation DRAM (1c node) yields. The development is fueling optimism about a potential rebound in the HBM market. Spearheading this turnaround is Jun Young-hyun, CEO and head of the Device Solutions (DS) division, who returned in May 2024 and initiated a high-stakes redesign of Samsung's DRAM architecture to reverse recent setbacks.

South Korea's semiconductor giants, Samsung Electronics and SK Hynix, are ramping up the adoption of artificial intelligence (AI)-driven electronic design automation (EDA) to bolster their competitive edge in next-gen chip production. The companies have started implementing AI-based design solutions across advanced process nodes and memory products, reporting notable progress in efficiency and innovation.

Amid intensifying US-China tensions and persistent uncertainty in global demand, major memory chipmakers are moving to phase out DDR4 DRAM, triggering a rapid spike in prices as supply constraints ripple through the market.

The global HBM market is undergoing a seismic shift, propelled by surging demand for AI and high-performance computing. South Korea's memory heavyweights—Samsung Electronics and SK Hynix—are leading this charge, combining deep R&D with strategic alliances to extend their technological edge. In contrast, China's DRAM challengers continue to be hampered by sanctions and capacity constraints. This article breaks down the market forces, innovation race, and geopolitical headwinds shaping the HBM landscape.