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Saturday 14 June 2025
Samsung to benefit from soaring DDR4, LPDDR4 prices in 2Q25
The recent increase in mature process DRAM prices is expected to boost Samsung Electronics' DRAM business revenue, offsetting the sluggishness in its high bandwidth memory (HBM) business and fueling momentum for its performance in the second quarter of 2025.
Friday 13 June 2025
AMD confirms Samsung, Micron memory in MI350 chips in bid to break Nvidia's grip on AI
AMD on June 12 officially confirmed that its next-generation AI accelerators—the Instinct MI350X and MI355X—will feature 12-high HBM3E memory supplied by Samsung and Micron. The confirmation marks a strategic win for Samsung, which has faced challenges qualifying its HBM3E for use in Nvidia's AI chips.
Friday 13 June 2025
Micron ships HBM4 to key customers, targets solid market share in 2025
As data centers face increasing demands for AI training and inference workloads, high-bandwidth memory (HBM) has become a critical competitive edge for memory manufacturers. Micron announced that its 12-layer stacked 36GB HBM4 samples have been delivered to multiple major customers. Utilizing the 1β DRAM process technology, mass production is expected to begin in 2026 to support customer growth on next-generation AI platforms.
Friday 13 June 2025
SK Hynix unveils 30-Year DRAM roadmap with Vertical Gate, 3D stack in bid to extend Moore's Law
SK Hynix has unveiled a long-term roadmap for next-generation DRAM technologies, laying out a vision that aims to drive sustainable innovation over the next 30 years as the global semiconductor industry undergoes rapid transformation.
Friday 13 June 2025
Micron reportedly clinches SOCAMM lead with Nvidia's greenlight
Nvidia has reportedly tapped Micron Technology as the first supplier of its next-generation small outline compression attached memory module (SOCAMM) chips, putting the US-based memory maker ahead of Samsung Electronics and SK Hynix in the race to power next-gen AI servers.
Friday 13 June 2025
Samsung, SK Hynix redo strategies ahead of HBM4 mass production, says report
As mass production of sixth-generation HBM4 nears, South Korean chip giants Samsung Electronics and SK Hynix are aggressively reconstructing their semiconductor equipment supply chains to strengthen competitiveness, reported Korean medium IT Chosun.
Friday 13 June 2025
Micron pledges US$200 billion investment in US manufacturing
Chipmaker Micron Technology Inc. said it will spend about US$200 billion on US manufacturing, research and development, the latest company to pledge large-scale investments in the country since President Donald Trump won election.
Thursday 12 June 2025
SK Hynix warns of rockier 2H25, leans on multi-sourcing strategy
SK Hynix President and CEO Kwak Noh-jung warned that growing tariff-related uncertainty could heighten market volatility in the second half of 2025. He shared these views during the company's quarterly "THE Communication Event Together" at its Icheon headquarters in South Korea, which was also streamed live to business sites across the country, according to ETNews, Hankook Daily, and Yonhap News.
Thursday 12 June 2025
Samsung reportedly fails third Nvidia HBM3E test; eyes re-certification in September
Samsung Electronics has reportedly failed its third attempt at obtaining Nvidia's certification for 12-layer HBM3E chips in June 2025, according to a recent report by a Hong Kong brokerage cited by South Korea's Businesspost. The tech giant is now targeting a fourth certification attempt in September.
Thursday 12 June 2025
Memory price rally drives May gains for Adata and Team Group; 3Q outlook remains upbeat
Taiwan-based memory module vendors Adata Technology and Team Group Inc. saw notable revenue gains in May 2025, driven by continued price increases for DRAM and NAND flash. Adata reported NT$4.169 billion (approx. US$139.3 million) in consolidated revenue—its best May performance on record and highest monthly total since April 2010. Team Group posted NT$1.202 billion (approx. US$40.2 million), marking a 6.6% month-over-month rise and its second-best May result to date.
Wednesday 11 June 2025
DDR4 crunch sends prices soaring 50%
Memory manufacturers are reducing production capacity for older processes, driving DDR4 prices to skyrocket. Although Samsung Electronics' last buy order (LBO) for DDR4 was originally scheduled to end in June 2025, with production ceasing by the end of the year, memory module makers are already struggling to secure supply.
Wednesday 11 June 2025
CXMT accelerates DDR5 memory production, phases out DDR4
In a sign of China's accelerating ambitions in the semiconductor race, ChangXin Memory Technologies (CXMT), the country's leading DRAM manufacturer, is rapidly advancing development of next-generation memory technologies. Departing from its original plan to commercialize DDR5 using a 17-nanometer process, CXMT is now opting for a more advanced 16-nanometer node. A 15-nanometer process is also under development, with mass production targeted for late 2026.
Wednesday 11 June 2025
SK Hynix weighs TCB suppliers: Hanmi, Hanwha face off for 2H25 HBM3E equipment orders
SK Hynix is approaching the final delivery deadline for its May orders of thermal compression bonding (TCB) equipment from Hanmi Semiconductor and Hanwha Semitech, as the industry focus shifts to which vendor will secure contracts for the second half of 2025.
Wednesday 11 June 2025
Micron ships HBM4 samples to key customers, targets 2026 ramp up
According to a press release on June 10, Micron Technology announced it has begun shipping samples of its 36GB HBM4 with 12-high stacking to multiple customers. The new memory is built on Micron's 1-beta DRAM process and features a 2048-bit interface capable of exceeding 2.0 TB/s per stack — more than a 60% performance improvement over its predecessor.
Wednesday 11 June 2025
Samsung and Groq to produce world's fastest AI chip using 4nm process, mass production slated for 2H25
Samsung Electronics' foundry division is targeting the artificial intelligence (AI) chip market with a new collaboration alongside Groq, aiming to bring their jointly developed chip into mass production. Groq CEO Jonathan Ross recently stated that together with Samsung Foundry, they have created a truly outstanding chip on a global scale.
Tuesday 10 June 2025
YMTC sues Micron over 'spyware' allegations amid ongoing patent, IP battles
Chinese memory chipmaker Yangtze Memory Technologies Co. (YMTC) has filed a federal lawsuit in Washington, DC, accusing US-based Micron Technology of launching a disinformation campaign that falsely characterizes YMTC's chips as spyware-laden and a threat to national security.
Tuesday 10 June 2025
Chinese tech giants pivot to local memory suppliers as trade tensions persist
China's largest cloud and internet companies are implementing backup supply chain strategies as bilateral trade uncertainties continue. Baidu Inc., Alibaba, Tencent and Huawei have developed contingency plans with domestic memory module manufacturers, beginning gradual localization in early 2025.
Tuesday 10 June 2025
Samsung likely to rely on HBM4 as UBS reports delay in 12-layer HBM3E certification
European financial securities firm UBS recently released a report indicating that Samsung Electronics' anticipated 12-layer HBM3E, originally expected by June 2025, may not be ready to supply Nvidia until the fourth quarter of 2025.
Tuesday 10 June 2025
India approves Micron's investment plan in SEZ rule relaxation
The Indian government has amended Special Economic Zone (SEZ) rules to support semiconductor and electronics component manufacturing, reducing the minimum land requirement from 50 hectares to 10 hectares for SEZs dedicated to these sectors. The changes, notified on June 3, 2025, also relax conditions on encumbrance-free land, allowing mortgaged or leased land held by government agencies to be used for SEZ purposes.
Monday 9 June 2025
Kioxia to double NAND memory production by 2029, next-gen SCM launch set for 2026
Kioxia, Japan's leading NAND flash memory manufacturer, is preparing for an aggressive expansion. The company has announced a bold plan to double its memory production capacity by fiscal year 2029, with a focus on increasing output to meet growing demand from sectors like artificial intelligence.
Monday 9 June 2025
Samsung reportedly races to LPDDR6 with 1c DRAM by late 2025 to fend off Chinese rival
Samsung Electronics is accelerating its development of next-generation low-power memory technology, aiming to begin production of LPDDR6 using its advanced 1c DRAM process in the second half of 2025, according to a report by South Korean media outlet Businesspost. The company reportedly plans to supply major global tech firms such as Qualcomm, a strategic move to reinforce its leadership and counter rising competition from China's ChangXin Memory Technologies (CXMT).
Monday 9 June 2025
Samsung union loses nearly 7,000 members amid leadership crisis
Samsung Electronics's largest labor union lost almost 7,000 members in two months following the mass resignation of its executive leadership, potentially disrupting negotiations with management as the South Korean chipmaker grapples with production challenges and intensifying competition from TSMC.
Monday 9 June 2025
Phison reports May consolidated revenue of US$175 million
Taiwan-based NAND controller manufacturer Phison Electronics posted a May 2025 consolidated revenue of NT$5.69 billion (approx. US$175 million), down 5.2% from the previous month but up 6% year-over-year. Cumulative revenue for January through May reached NT$25.531 billion, declining 5.7% annually but marking the third-highest on record.
Monday 9 June 2025
Weekly news roundup: Arm's rebrand, Huawei's R&D blitz, and Asia's rising AI chip challengers
These are the most-read DIGITIMES Asia stories from June 2 to June 8, 2025. Top highlights include Arm's strategic rebrand and entry into proprietary chip design, Huawei's aggressive R&D-driven resurgence, and growing momentum across Asia in AI semiconductors and advanced packaging. As global tech giants recalibrate in response to shifting supply chain dynamics, export controls, and rising open-source threats, the week's top stories reflect deepening fault lines—and fresh opportunities—across the semiconductor and system architecture landscape.
Monday 9 June 2025
Korean equipment firms see Chinese memory makers flooding premium orders amid US curbs
South Korean semiconductor equipment manufacturers are seeing a surge in demand from Chinese memory chipmakers, according to a report from Hankyung. ChangXin Memory Technologies (CXMT) and Yangtze Memory Technologies (YMTC) are placing urgent bulk orders - some reportedly at premiums of 1.7-2 times the original price - to secure tools essential for producing advanced LPDDR5 DRAM and high-bandwidth memory (HBM) products.