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Monday 16 June 2025

Intelligo leverages AI acoustics to power Switch 2, drive 150% revenue surge in 2025

Taiwan-based Intelligo, an ASIC design firm focused on AI acoustics and voice recognition, expects substantial growth in 2025 driven by three core segments—gaming consoles, mobile-related businesses, and a new North American notebook client—according to chairman JJ Yan. The company projects strong year-over-year increases in both revenue and profit compared to 2024.

Monday 16 June 2025

Hanwha Semitech faces patent war with Hanmi Semiconductor over TCB breakthrough

A high-stakes patent dispute between Hanwha Semitech and Hanmi Semiconductor over a critical piece of equipment in the HBM production process — the TCB machine — is set to unfold, with significant implications for the HBM industry. The outcome of this legal battle is expected to influence SK hynix, the global leader in HBM production, given the pivotal role TCB technology plays in semiconductor manufacturing.

Monday 16 June 2025

Beyond sci-fi: AI robots push PCB players into new frontier

Rapid advances in generative AI are accelerating the commercialization of humanoid robots, with 2025 projected as the industry's first year of mass production. Taiwanese PCB makers—Zhen Ding Technology (ZDT), Flexium Interconnect, and Ichia Technologies—are reportedly positioning themselves within the emerging supply chain.

Monday 16 June 2025

Canon Anelva looks to AI and compact equipment to outpace flat market

Canon's semiconductor business, best known for its photolithography equipment, is also bolstered by a range of specialized subsidiaries. One such unit, Canon Anelva, focuses primarily on thin-film deposition systems — a critical component in semiconductor manufacturing. Despite projections that the broader market will remain flat in 2025 compared to 2024, Canon Anelva expects to achieve more than 20% revenue growth, driven by two flagship product lines.

Monday 16 June 2025

Weekly news roundup: Intel, Samsung, TSMC shift chip strategy, DDR4 surges, China rises in AI and CIS

Below are the most-read DIGITIMES Asia stories from June 9 to June 15, 2025. Highlights include major chipmaking advances, a DDR4 supply crunch, and shifting strategies from Intel, Samsung Electronics, and TSMC. From renewed EDA access in China to rising momentum among Chinese CIS suppliers, this roundup tracks the key forces reshaping the global semiconductor and AI landscape.

Monday 16 June 2025

Everlight pivots to SiC and photonics amid pricing wars

Everlight Electronics, a longtime profit leader in Taiwan's LED packaging sector, plans to begin pilot production of SiC components in the second half of 2025. Chairman Robert Yeh said the company is confident it can replicate its LED market success in the competitive SiC space. The initial rollout will target discrete power devices, particularly MOSFETs, where Everlight aims to capitalize on cost efficiencies to stay competitive against aggressive Chinese pricing.

Saturday 14 June 2025

Broadcom's AI chip sales hit 52%, with SoftBank and OpenAI on deck

Broadcom is emerging as a key supplier in the artificial intelligence (AI) supply chain, with revenue from AI-related chips now comprising a majority of its semiconductor business.

Saturday 14 June 2025

China’s chip tool reboot: AMEC backs a “2.5-player” play

In late April 2025, South Korea's ZDNet Korea reported that China is moving ahead with a major overhaul of its domestic semiconductor equipment sector, aiming to consolidate more than 200 companies into roughly 10 key players. While the announcement drew international attention, industry insiders in China have long seen this as an inevitable, if largely unspoken, challenge.

Friday 13 June 2025

Taiwanese chip tester MPI sees three-year order visibility as AI drives demand

Taiwan's MPI Corporation, a major producer of probe cards and semiconductor test equipment, said artificial intelligence infrastructure demand is driving capacity utilization to maximum levels, with customers providing order forecasts stretching three years ahead.

Friday 13 June 2025

AI-fueled demand lifts Keystone Microtech's 2025 forecast; FX risk clouds margin outlook

Taiwan's test interface supplier Keystone Microtech Corp. expects sustained order momentum through late 2025, fueled by growing demand for chip testing in AI and high-performance computing (HPC) applications. At the company's annual shareholder meeting, Director and President An-hsuan Liu said order visibility remains strong through the fourth quarter and projected minimal impact from reciprocal tariffs on the broader semiconductor market in the second half of the year. Keystone is forecasting sequential revenue increases and targeting double-digit annual growth.

Thursday 12 June 2025

China's MLCC makers carve out 10% share — How does Semco adjust course?

Chinese multilayer ceramic capacitor (MLCC) manufacturers—including Guangdong Fenghua Advanced Technology, Chaozhou Three-Circle Group, and Eyang Technology—have rapidly expanded their global market share, reaching an estimated 10% of total revenue in the second half of 2024. That reflects a four-percentage-point gain from 2019 and signals growing competitive pressure on incumbents such as Samsung Electro-Mechanics (Semco), according to Business Post and Futubull.

Wednesday 11 June 2025

Nan Ya PCB sees another executive change as president Andy Tang retires

IC substrate manufacturer Nan Ya PCB announced that company president Andy Tang will retire and step down on June 16, 2025. The company has yet to announce a successor.

Wednesday 11 June 2025

Taiwan-Korea alliance targets semiconductor materials dominance

PCB wet process equipment and semiconductor materials agent Ampoc recently announced a strategic technical partnership with South Korean semiconductor materials leader DCT Material. The collaboration aims to expand their presence in the Asian market and capture opportunities in the global advanced semiconductor process high-end materials sector, potentially breaking the long-standing monopoly held by certain major players.

Wednesday 11 June 2025

China's STAR Market reforms spark record M&A wave as tech firms seek scale and strategy

Marking the first anniversary of China's "Eight Measures for the STAR Market"—a landmark reform package aimed at boosting tech innovation and industrial upgrading—the country has recorded its biggest-ever merger in the computing power sector.

Tuesday 10 June 2025

Ampoc partners with South Korea's DCT Material to expand advanced process materials market

Ampoc, a distributor of PCB wet process equipment and semiconductor materials, announced that in response to the growing global demand for high-end materials in advanced semiconductor processes, it will collaborate with South Korean semiconductor material manufacturer DCT Material to establish a joint venture company in Taiwan by the end of 2025. This partnership aims to introduce advanced process material technologies with mass production experience into Taiwan, further strengthening product deployment in the Asian market and providing localized services to key semiconductor customers.

Monday 9 June 2025

Shibaura takeover heats up as Yageo moves closer to Japan's regulatory green light

Taiwan-based Yageo Corporation has refiled its foreign investment application under Japan's Foreign Exchange and Foreign Trade Act (FEFTA) as of June 2, in a renewed bid to acquire Shibaura Electronics. The move signals Yageo's growing confidence in clearing regulatory scrutiny—a key barrier that has held back its unsolicited tender offer since February.

Monday 9 June 2025

First Hi-tec targets NT$10 billion revenue in 2025 on AI server boom

Taiwan-based niche PCB maker First Hi-tec Enterprise is riding strong momentum from the AI server sector and expects its 2025 revenue to surpass NT$10 billion (US$307 million), according to CFO Chiu-Hsiung Chang. Fueled by robust AI-related orders in the first quarter of 2025 and continued product mix optimization, the company forecasts sequential quarterly growth throughout the year. Server-related sales are expected to account for over 50% of total revenue in the second half of 2025.

Saturday 7 June 2025

GBM's acquisition of Lincstech: GM says benefits will be gradual

Walsin's PCB business unit, PSA, together with its subsidiary GBM, recently held an investor conference. When the operational benefits from GBM's acquisition of Japan's major PCB manufacturer Lincstech will become apparent was a key focal point.

Thursday 5 June 2025

LPKF reportedly enforces glass substrate patents amid intensifying industry competition

German laser technology provider LPKF has begun actively asserting its patents related to semiconductor glass substrate technology, signaling a potentially more aggressive posture as competition in the emerging field intensifies. Industry observers see this move as a strategic effort to raise barriers to entry as global interest in glass-based substrates grows.

Wednesday 4 June 2025

Semco reportedly expanding semiconductor-use glass substrate ecosystem

Samsung Electro-Mechanics (Semco) reportedly has begun building a glass substrate ecosystem to support the development of next-generation semiconductors, with Samsung Electronics serving as a major partner.

Wednesday 4 June 2025

CoWoS material shortage triggers AI supply chain concerns; TSMC and ASE expected to receive priority access

As the surge in demand for high-performance computing (HPC) chips driven by artificial intelligence (AI) continues, the semiconductor industry has reported that Japanese chemical giant Asahi Kasei is planning to cut off supplies of its advanced packaging key material, photosensitive polyimide (PSPI), to some customers due to capacity constraints.

Tuesday 3 June 2025

Nittobo announces 20% price increase on fiberglass products

Leading Japanese glass cloth manufacturer Nittobo Boseki announced on June 2, 2025, that it will increase the price of certain fiberglass products in its composite materials business by 20% starting August 1, 2025. Products affected include roving, chopped strands, chopped strand mats, roving cloths, cut fibers, and surface mats.

Tuesday 3 June 2025

Chip packaging material shortage deepens as top supplier raises prices 20%

Rising artificial intelligence chip demand has strained supplies of critical materials used in advanced semiconductor packaging, with Japan's Nittobo announcing price increases of as much as 20% starting August 2025 amid persistent shortages.

Tuesday 3 June 2025

Flexium Interconnect pushes forward in AI server while rejoining Apple suply chain amid transformation challenges

Flexible printed circuit (FPC) maker Flexium Interconnect is navigating a critical phase of transformation as it shifts its business focus toward next-generation technologies. While the company has made strides in the AI server sector, particularly in liquid cooling sensor modules, it is grappling with yield issues and delayed customer production timelines, which have kept shipment volumes and capacity utilization below previous levels.

Tuesday 3 June 2025

Exclusive: Renesas to sell near-new SiC gear as EV pivot clouds Taiwan partnerships

Renesas Electronics is reportedly exiting its silicon carbide (SiC) initiative, with Japanese media confirming the company has canceled plans for mass production in early 2025 and dissolved the dedicated development team. Citing Nikkei, Nikkan, and Jiji, industry sources note that Renesas has long focused on automotive logic ICs and insulated-gate bipolar transistors (IGBTs). Its expansion into SiC and gallium nitride (GaN) power components was a response to growing demand from the EV industry.

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